PUBLICATIONS2018-11-20T17:28:10+00:00

Papers

38. Y. Arafat, S. T. Sultana, I. Dutta, R. Panat, “Effect of Additives on the Microstructure of Electroplated Tin Films”, in review.

37. R. Panat, J.Park, M. S. Saleh, and J. Li, “3D-Printed Lattice Batteries”, Homeland Defense Information Analysis Center (HDIAC) Journal, 5 (4), pp. 11 (2018). PDF

36. J. Li, X. Liang, R. Panat, and J. Park, “Enhanced Battery Performance through Three-Dimensional Structured Electrodes: Experimental and Modeling Study” Journal of the Electrochemical Society, 165 (14), A3566-A3573 (2018). PDF

35. R. Danaei, T. Varghese, M. Ahmadzadeh, J. McCloy, C. Hollar, M. Sadeq Saleh, J. Park, Y. Zhang, R. Panat, “Ultrafast Fabrication of Thermoelectric Films by Pulsed Light Sintering of Colloidal Nanoparticles on Flexible and Rigid Substrates”, Advanced Engineering Materials, in press (2018). PDF
Link: https://doi.org/10.1002/adem.201800800

34a. “3D printing of Li-ion Battery Electrodes”, article about our work in the Tribology and Lubrication Technology Magazine, Nov 2018. PDF

34. M. Sadeq Saleh, Jie Li, Jonghyun Park, and Rahul Panat, “3D Printed Hierarchically-Porous Microlattice Electrode Materials for Exceptionally High Specific Capacity and Areal Capacity Lithium Ion Batteries”, Additive Manufacturing, Vol.23, pp 70-78 (2018). PDF

The research appeared in several media outlets  including Forbes Magazine….
1- Forbes Magazine: See How This New 3D Printing Method Could Make Your Smartphone Last Longer
2- Green Car CongressCMU-led team develops 3D printing method  for exceptionally high capacity batteries
4- Printed electronics:  3D printing the next generation of batteries
5- 3D Printing Industry: 3D Printing creates major advance for longer lasting batteries
6- CMU news: 3D Printing the next generation of batteries
7- German Media: New “Aerosol Jet” method relies on 3D printing for electrodes of lithium-ion batteries and promises longer battery life
8- Japanese media: 3D打印技术造出微观多孔锂电池,容量提升了4倍

33. Y. Arafat, R. Panat, I. Dutta, “Highly Stretchable Metal Films on Polymer Substrates: Mechanics and Mechanisms”, IEEE ITherm2018, pp. 32-36 (2018) PDF, Link

32. M. Sadeq Saleh, Mehdi HamidVishkasougheh, H. Zbib, and R. Panat, “Polycrystalline Micropillars by a Novel 3-D Printing Method and Their Behavior under Compressive Loads”, Scripta Materialia,  Volume 149, 144–149, 2018. PDF

31. M. T. Rahman, R. Moser, H. Zbib, C. V. Ramana, and R. Panat, “3D Printed High Performance High Temperature Sensors”, Journal of Applied Physics,  123, 024501, 2018. PDF

CMU News: 3D Printing Remakes the Strain Gauge
News on Physics.org
News on Business Standard (Indian News)
News on 3D Print Magazine

30. M. Sadeq Saleh, C. Hu, and R. Panat, “Three Dimensional Micro-architected Materials and Devices using Nanoparticle Assembly by Pointwise Spatial Printing”, Science Advances, 3, e1601986, 2017PDF  http://dx.doi.org/10.1126/sciadv.1601986

29. J. Geng, M. T. Rahman, R. Panat, and L. Li, “Self-assembled Axisymmetric Microscale Periodic Wrinkles on Elastomer Fibers”, ASME Journal of Micro and Nano-manufacturingVol. 5, Issue 2, pp. 021006, 2017. PDF  http://dx.doi.org/10.1115/1.4036112

28. R. Sun, H. Yang, M. Rock, R. Danaei, R. Panat, M. Kessler, and L. Li, “Manufacturing PDMS Micro Lens Array using Spin Coating under a Multiphase System”, Journal of Micromechanics and Microengineering, Vol. 27(5), pp.1, 2017. PDF

27. M. T. Rahman, J. Gomez, K. Mireles, P. Wo, J. Marcial, M. Kessler, J. McCloy, C. Ramana, and R. Panat, “High temperature physical and chemical stability and oxidation reaction kinetics of Ni-Cr nanoparticles”, Journal of Physical Chemistry – C, Vol.121 (7), pp. 4018–4028, 2017. PDF 

26. J. Li, M. Leu, R. Panat and J. Park, “A Hybrid Three-Dimensionally Structured Electrode for Lithium-ion Batteries via 3D Printing”, Materials and Design, Vol. 119, pp. 417-424, 2017PDF

25. Brian Paul, Rahul Panat, Christina Mastrangelo, and David Kim, and David Johnson “Manufacturing of Smart Goods: Current State, Future Potential, and Research Recommendations”,  ASME Journal of Micro and Nano-manufacturingVol. 4, Issue 4, pp. 044001-1 to 044001-12, 2016. PDF

24. Y. Arafat, I. Dutta, R. Panat, “On the Deformation Mechanisms and Electrical Behavior of Highly Stretchable Metallic Interconnects on Elastomer Substrates”, Journal of Applied Physics, Vol. 120, Issue 11, pp. 115103-1 to 11, 2016. PDF

23. M. T. Rahman, J. McCloy, C. V. Ramana, and R. Panat, “Structure, Electrical Characteristics and High-Temperature Stability of Aerosol Jet Printed Silver Nanoparticle Films”, Journal of Applied Physics, Vol. 120, Issue 7, pp. 075305-1 to 11, 2016. PDF

22. M. T. Rahman, A. Rahimi, S. Gupta, and R. Panat, “Microscale Additive Manufacturing and Modeling of Interdigitated Capacitive Touch Sensors”, Sensors and Actuators A: Physical, Vol. 248, 94-103, 2016. PDF

21. H. Yang, M. T. Rahman, D. Du, R. Panat, and Y. Lin, “3-D Printed Adjustable Microelectrode Arrays for Electrochemical Sensing and Biosensing”, Sensors and Actuators B: Chemical, Vol. 230, 600-606, 2016. PDF

20. Y. Arafat, I. Dutta, R. Panat, “Super-stretchable Metallic Interconnects on Polymer with a Linear Strain of up to 100%” Applied Physics Letters, 107, 081906, 2015 PDF

19. M. T. Rahman, L. Renaud, M. Renn, D. Heo, R. Panat, “Aerosol Based Direct-Write Micro-Additive Fabrication Method for Sub-mm 3-D Metal-Dielectric Structures” Journal of Micromechanics and Microengineering, Vol. 25 (10), 107002 (2015). PDF

18. R. Panat, “A Model for Crack Initiation in the Li-ion Battery Electrodes”, Thin Solid Films, Vol. 596, pp. 174 178 (2015). PDF

17. M. T. Rahman, L. Renaud, M. Renn, D. Heo, R. Panat, “3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method”, ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Paper No. IPACK2015-48187, pp. V003T03A002 (2015) Link

16. Y. Arafat, I. Dutta, R. Panat, “Highly Stretchable Interconnects for Flexible Electronics Applications” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Paper No. IPACK2015-48130, pp. V002T02A029 (2015) Link

15. Z. Song, T. Ma, R Tang, Q. Cheng, X. Wang, D. Krishnaraju, R. Panat, C. K. Chan, H. Yu, and H. Jiang, “Origami Lithium Ion Batteries”, Nature Communications, 5:3140, 10.1038/ncomms4140, (2014). PDF

14. R. Panat, S. Dattaguru, H. Balkan, Y. Min, H. Seh, X. Zhao, “Mechanical Reliability of Embedding of Components in Ultra-High Performance Microprocessors”, IEEE Transactions on Device and Materials Reliability, Vol. 4 (5), 857 (2014). PDF.

13. R. Panat, E. Parks, and J. Wang, “Effects of triboelectrostactic changing between polymer surfaces in manufacturing and test of integrated circuit packages”, IEEE Transactions on Components, Packaging and Manufacturing Vol. 4 (5), 943 (2014). PDF.

12. R. Panat, “On the data and analysis of research output of India and China: India has significantly fallen behind China”, Scientometrics (Springer), Vol. 100 (2), 471-481 (2014).PDF.

11. R. Panat, V. Dimitrova, S. Selvamundiany, K. Ishiko, and D. Sun, “The application of Lean Six Sigma to the configuration control in Intel’s manufacturing R&D environment”, International Journal of Lean Six Sigma, Vol. 5 No. 4, 444-459 (2014). PDF

10. Y. Min, R. Olmedo, M. Hill, K. Radhakrishnan, K. Aygun, M. Kabiri-badr, R. Panat, S. Dattaguru, and H. Balkan, “Embedded Capacitors in the Next Generation Processor”, 63rd ECTC Conference, IEEE, 1225-1229 (2013). PDF.

9. N. Raravikar, R. Panat, and S. Jadhav, “A tombstone initiation model for small form factor surface mount passives” IEEE Transactions on Components, Packaging and Manufacturing, Vol. 2 (9), 1486-1491 (2012).

8. Li Yan, R. Panat, R. Mulligan, P. Srinath, and A. Raman, “The application of 2D X-ray hot stage in flip chip package failure analysis”, IEEE Transactions on Device and Materials ReliabilityVol. 11 (1), 141-147 (2011). PDF.

7. R. Panat, K.J. Hsia and D.G. Cahill, “Evolution of surface waviness in thin films via volume and surface diffusion”, Journal of Applied Physics, 97, 013521 (2005).PDF.

6.  R. Panat, K.J. Hsia and J. Oldham, “Observation of rumpling instability in thermal barrier systems under isothermal conditions in vacuum”, Philosophical Magazine, 85 (1), 45-64 (2005).PDF

5. R. Panat and K.J. Hsia, “Experimental investigation of the bond coat rumpling instability under cyclic and isothermal temperature histories in thermal barrier systems,” Proceedings of the Royal Society of London, Series A, Vol. 460, 1957-1979 (2004).PDF.

4. R. Panat, S. Zhang and K.J. Hsia, “Bond coat surface rumpling in thermal barrier coatings” Acta Materialia, 51, 239-249 (2003).PDF.

3. S. Zhang, R. Panat and K.J. Hsia, “Influence of surface morphology on the adhesion strength of aluminum/epoxy interfaces”, Journal of Adhesion Science and Technology, 17 (12), 1685-1711 (2003). PDF

2. R. Panat, K. Jakus, J.E. Ritter and P. Shah, “Erosion and strength degradation of an elastic modulus graded alumina-glass composite,” Ceramic Engineering and Science Proceedings, 21, 3 (2000) 635. PDF

1.  J.E. Ritter, K. Jakus, R. Panat, “Impact damage and strength degradation of fused silica,” MRS Symposium Proceedings, 531 (1998) 53. Link

Patents

  • R. Panat and D. Heo, “Three-dimensional sub-mm wavelength sub-THz frequency antennas on flexible and in-situ cured dielectric using printed metal structures”, U.S. Patent # 10086432, issued Oct 2018. PDF
  • R. Panat and D. Heo, “Three-dimensional passive components”, U.S. Patent #9969001, issued May 2018. PDF
  • R. Panat and L. Lei, “Low-cost fiber optic sensor for large strain”, US Patent #9846276 , issued December 2017. Link
  • I. Dutta and R. Panat,” Highly stretchable interconnect devices and systems”, US Patent #9770759, issued Sept 2017. Link
  • R. Panat and B. Jaiswal, “Nanowires coated on traces in electronic devices”, US Patent #9627320, issued April 2017. PDF
  • N. Raravikar and R. Panat, “Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing the same”, US Patent #8068328, issued May 2014. Link
  • R. Panat, “Additive manufacturing of porous scaffold structures”, U. S. Patent Application # 14/957,849, filed Dec 2015. Link