PUBLICATIONS 2018-02-18T14:27:58+00:00

AMML is hiring!

(Positions for MS/PhD; Job advertisement for Postdoc)

Patents

  • R. Panat and L. Lei, “Low-cost fiber optic sensor for large strain”, US Patent Number 9846276 , issued December 2017. Link
  • I. Dutta and R. Panat,” Highly stretchable interconnect devices and systems”, US Patent Number 9770759, issued Sept 2017. Link
  • R. Panat and B. Jaiswal, “Nanowires coated on traces in electronic devices”, US Patent Number 9627320, issued April 2017. Link
  • N. Raravikar and R. Panat, “Nanolithographic method of manufacturing an embedded passive device for a microelectronic application, and microelectronic device containing the same”, US Patent Number 8068328, issued May 2014. Link
  • R. Panat and D. Heo, “Three-dimensional passive components”, U.S. Patent Application # 14/964,451, filed Dec 2015. Will be issued soon (2018).  Link
  • R. Panat, “Additive manufacturing of porous scaffold structures”, U. S. Patent Application # 14/957,849, filed Dec 2015. Link
  • R. Panat and D. Heo, “Three-dimensional sub-mm wavelength sub-THz frequency antennas on flexible and in-situ cured dielectric using printed metal structures”, U.S. Patent Application # 14/964,635, filed Dec 2015. Link

Papers

32. M. Sadeq Saleh, Mehdi HamidVishkasougheh, H. Zbib, and R. Panat, “Polycrystalline Micropillars by a Novel 3-D Printing Method and Their Behavior under Compressive Loads”, Scripta Materialia,  in press, 2018.

31. M. T. Rahman, R. Moser, H. Zbib, C. V. Ramana, and R. Panat, “3D Printed High Performance High Temperature Sensors”, Journal of Applied Physics,  123, 024501, 2018. PDF

CMU News: 3D Printing Remakes the Strain Gauge
News on Physics.org
News on Business Standard (Indian News)
News on 3D Print Magazine

30. M. Sadeq Saleh, C. Hu, and R. Panat, “Three Dimensional Micro-architected Materials and Devices using Nanoparticle Assembly by Pointwise Spatial Printing”, Science Advances, 3, e1601986, 2017. PDF  http://dx.doi.org/10.1126/sciadv.1601986

29. J. Geng, M. T. Rahman, R. Panat, and L. Li, “Self-assembled Axisymmetric Microscale Periodic Wrinkles on Elastomer Fibers”, ASME Journal of Micro and Nano-manufacturingVol. 5, Issue 2, pp. 021006, 2017. PDF  http://dx.doi.org/10.1115/1.4036112

28. R. Sun, H. Yang, M. Rock, R. Danaei, R. Panat, M. Kessler, and L. Li, “Manufacturing PDMS Micro Lens Array using Spin Coating under a Multiphase System”, Journal of Micromechanics and Microengineering, Vol. 27(5), pp.1, 2017. PDF

27. M. T. Rahman, J. Gomez, K. Mireles, P. Wo, J. Marcial, M. Kessler, J. McCloy, C. Ramana, and R. Panat, “High temperature physical and chemical stability and oxidation reaction kinetics of Ni-Cr nanoparticles”, Journal of Physical Chemistry – C, Vol.121 (7), pp. 4018–4028, 2017. PDF 

26. J. Li, M. Leu, R. Panat and J. Park, “A Hybrid Three-Dimensionally Structured Electrode for Lithium-ion Batteries via 3D Printing”, Materials and Design, Vol. 119, pp. 417-424, 2017. PDF

25. Brian Paul, Rahul Panat, Christina Mastrangelo, and David Kim, and David Johnson “Manufacturing of Smart Goods: Current State, Future Potential, and Research Recommendations”,  ASME Journal of Micro and Nano-manufacturingVol. 4, Issue 4, pp. 044001-1 to 044001-12, 2016. PDF

24. Y. Arafat, I. Dutta, R. Panat, “On the Deformation Mechanisms and Electrical Behavior of Highly Stretchable Metallic Interconnects on Elastomer Substrates”, Journal of Applied Physics, Vol. 120, Issue 11, pp. 115103-1 to 11, 2016. PDF

23. M. T. Rahman, J. McCloy, C. V. Ramana, and R. Panat, “Structure, Electrical Characteristics and High-Temperature Stability of Aerosol Jet Printed Silver Nanoparticle Films”, Journal of Applied Physics, Vol. 120, Issue 7, pp. 075305-1 to 11, 2016. PDF

22. M. T. Rahman, A. Rahimi, S. Gupta, and R. Panat, “Microscale Additive Manufacturing and Modeling of Interdigitated Capacitive Touch Sensors”, Sensors and Actuators A: Physical, Vol. 248, 94-103, 2016. PDF

21. H. Yang, M. T. Rahman, D. Du, R. Panat, and Y. Lin, “3-D Printed Adjustable Microelectrode Arrays for Electrochemical Sensing and Biosensing”, Sensors and Actuators B: Chemical, Vol. 230, 600-606, 2016. PDF

20. Y. Arafat, I. Dutta, R. Panat, “Super-stretchable Metallic Interconnects on Polymer with a Linear Strain of up to 100%” Applied Physics Letters, 107, 081906, 2015 PDF

19. M. T. Rahman, L. Renaud, M. Renn, D. Heo, R. Panat, “Aerosol Based Direct-Write Micro-Additive Fabrication Method for Sub-mm 3-D Metal-Dielectric Structures” Journal of Micromechanics and Microengineering, Vol. 25 (10), 107002 (2015). PDF

18. R. Panat, “A Model for Crack Initiation in the Li-ion Battery Electrodes”, Thin Solid Films, Vol. 596, pp. 174 178 (2015). PDF

17. M. T. Rahman, L. Renaud, M. Renn, D. Heo, R. Panat, “3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method”, ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Paper No. IPACK2015-48187, pp. V003T03A002 (2015) Link

16. Y. Arafat, I. Dutta, R. Panat, “Highly Stretchable Interconnects for Flexible Electronics Applications” ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Paper No. IPACK2015-48130, pp. V002T02A029 (2015) Link

15. Z. Song, T. Ma, R Tang, Q. Cheng, X. Wang, D. Krishnaraju, R. Panat, C. K. Chan, H. Yu, and H. Jiang, “Origami Lithium Ion Batteries”, Nature Communications, 5:3140, 10.1038/ncomms4140, (2014). PDF

14. R. Panat, S. Dattaguru, H. Balkan, Y. Min, H. Seh, X. Zhao, “Mechanical Reliability of Embedding of Components in Ultra-High Performance Microprocessors”, IEEE Transactions on Device and Materials Reliability, Vol. 4 (5), 857 (2014). PDF.

13. R. Panat, E. Parks, and J. Wang, “Effects of triboelectrostactic changing between polymer surfaces in manufacturing and test of integrated circuit packages”, IEEE Transactions on Components, Packaging and Manufacturing Vol. 4 (5), 943 (2014). PDF.

12. R. Panat, “On the data and analysis of research output of India and China: India has significantly fallen behind China”, Scientometrics (Springer), Vol. 100 (2), 471-481 (2014).PDF.

11. R. Panat, V. Dimitrova, S. Selvamundiany, K. Ishiko, and D. Sun, “The application of Lean Six Sigma to the configuration control in Intel’s manufacturing R&D environment”, International Journal of Lean Six Sigma, Vol. 5 No. 4, 444-459 (2014). PDF

10. Y. Min, R. Olmedo, M. Hill, K. Radhakrishnan, K. Aygun, M. Kabiri-badr, R. Panat, S. Dattaguru, and H. Balkan, “Embedded Capacitors in the Next Generation Processor”, 63rd ECTC Conference, IEEE, 1225-1229 (2013). PDF.

9. N. Raravikar, R. Panat, and S. Jadhav, “A tombstone initiation model for small form factor surface mount passives” IEEE Transactions on Components, Packaging and Manufacturing, Vol. 2 (9), 1486-1491 (2012).

8. Li Yan, R. Panat, R. Mulligan, P. Srinath, and A. Raman, “The application of 2D X-ray hot stage in flip chip package failure analysis”, IEEE Transactions on Device and Materials ReliabilityVol. 11 (1), 141-147 (2011). PDF.

7. R. Panat, K.J. Hsia and D.G. Cahill, “Evolution of surface waviness in thin films via volume and surface diffusion”, Journal of Applied Physics, 97, 013521 (2005).PDF.

6.  R. Panat, K.J. Hsia and J. Oldham, “Observation of rumpling instability in thermal barrier systems under isothermal conditions in vacuum”, Philosophical Magazine, 85 (1), 45-64 (2005).PDF

5. R. Panat and K.J. Hsia, “Experimental investigation of the bond coat rumpling instability under cyclic and isothermal temperature histories in thermal barrier systems,” Proceedings of the Royal Society of London, Series A, Vol. 460, 1957-1979 (2004).PDF.

4. R. Panat, S. Zhang and K.J. Hsia, “Bond coat surface rumpling in thermal barrier coatings” Acta Materialia, 51, 239-249 (2003).PDF.

3. S. Zhang, R. Panat and K.J. Hsia, “Influence of surface morphology on the adhesion strength of aluminum/epoxy interfaces”, Journal of Adhesion Science and Technology, 17 (12), 1685-1711 (2003). PDF

2. R. Panat, K. Jakus, J.E. Ritter and P. Shah, “Erosion and strength degradation of an elastic modulus graded alumina-glass composite,” Ceramic Engineering and Science Proceedings, 21, 3 (2000) 635. PDF

1.  J.E. Ritter, K. Jakus, R. Panat, “Impact damage and strength degradation of fused silica,” MRS Symposium Proceedings, 531 (1998) 53. Link